Novel Ultrasonic Soldering Technique for Lead-Free Solders
نویسندگان
چکیده
منابع مشابه
Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects
Lead-free soldering, originally started as an environmental issue, is evolving rapidly into a business survival tool for the worldwide electronic industry. Promising lead-free solder alternatives for surface mount assembly applications include eutectic Sn/Ag, eutectic Sn/Cu, Sn95/Sb5, eutectic Sn/Bi, Sn/Ag/Cu, Sn/Ag/Cu/X, Sn/Bi/Ag/X, Sn/Zn/X, and Sn/In/Ag/(X). However, for wafer level area arra...
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Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations of tin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements hav...
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Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. This is being taken as an action to reduce environmental impact when such products are discarded. Despite the fact that lead containing solders in electronic assemblies account for only 0.49% of world lead consumption, the trend in legislation will likely be to require not only reduced lead...
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T he use of lead in the electronics industry today accounts for approximately 7% of total lead consumption.' The single largest use of lead is in the manufacture of storage batteries, which accounts for 60% of the total lead produced.2 The use of lead is closely regulated in plumbing, paint and gasoline industries. Currently, the electronics industry has been exempted from the existing requirem...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2004
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.45.703